Thermal compression bonding requires precise connection between materials (such as chips and substrates, metal bumps, etc.) under high temperature and pressure. Its success is highly dependent on temperature uniformity and control accuracy.

The temperature of optical modules is a very important indicator, which can adversely affect the performance and lifespan of optical modules.

The Thermal Inducing System plays a crucial role in scientific research. Its primary function is to provide and maintain a stable and pure low-temperature environment, which is essential for studying the unique properties and behaviors of substances at low temperatures.

Deep silicon etching technology is the core process for achieving high aspect ratio three-dimensional structure processing in the semiconductor manufacturing field, widely used in the core structures of transistors, storage capacitors, and MEMS manufacturing.

ZONGLEN's Temperature Forcing Systems have demonstrated significant technological advantages in CPO optical module testing, with core performance parameters highly matching the extreme testing requirements of CPO modules.

The semiconductor specific temperature control unit Chiller is an indispensable key equipment in integrated circuit manufacturing.

In the field of semiconductor reliability testing, particularly in HTOL (High Temperature Operating Life), the sample size of 77 is the "golden number" derived from statistical principles, industry standard practices, and a precise cost-benefit trade-off.

There are various types of 800G optical modules, and based on single channel speed, 800G optical modules can be roughly divided into two categories: single channel 100G and 200G.