In order to investigate the compatibility and reliability of copper (Cu) interconnects with glass substrates with different chemical properties, we prepared copper test structures on different glass substrates and conducted biased high acceleration stress testing (HAST).

The working principle of the wafer probe station is to achieve the transmission and measurement of electrical signals by contacting a set of micro probes with the testing points of the chip. These probes are usually made of metal materials and can be positioned with micrometer level accuracy.

The temperature chuck TC series developed by Zonglen is an air-cooled high and low temperature chuck system with a temperature range of -65 ℃ to 200 ℃, mainly composed of air-cooled high and low temperature chucks and air-cooled temperature controllers.

Probe station is a wafer probe testing equipment, which plays an important role in the semiconductor device manufacturing process. Through probe testing, abnormal grains in the wafer can be detected in a timely manner, reducing the processing cost of subsequent processes.

Environmental Stress Screening (ESS) test is a testing method that simulates the use of products under extreme environmental conditions to detect potential defects in product design and manufacturing processes.

Thermal compression bonding (TCB) process is a key technology in advanced packaging, which can integrate high-density components such as 3D stacked chips and high bandwidth memory (HBM).

Semiconductor equipment chiller, also known as semiconductor cooler, is a device used in the semiconductor manufacturing process to cool equipment or processes

Integrated circuit testing is the process of verifying the functionality and performance of integrated circuit chips during and after the manufacturing process to ensure their quality and reliability.