Parameter testing is usually performed after the wafer manufacturing process is completed (i.e. passivation has been carried out) and before the electrical performance sorting (electrical sorting) of the product bare chips.

Every power chip needs to undergo performance testing, and every wafer needs to undergo screening testing. The screening and testing of wafers must have wafer automation testing fixtures, namely automated high-voltage probe stations, as well as static parameter testing instruments.

In the chip specification sheet, there are three most helpful values for heat dissipation design: power consumption, temperature requirements, and thermal resistance parameters.

Packaging and testing play a crucial role in the field of integrated circuits. It can be divided into four stages: wafer testing, chip packaging, chip final testing, and system level testing.

Contact type high and low temperature impact machine can meet the requirements of live testing under high or low temperature conditions. The system can provide fast and accurate temperature conversion on the IC.

Mechanical Devices develops, produces, and provides innovative cost-effective thermal control units to major semiconductor device manufacturers for testing IC devices.

What do high acceleration enhancement testing and high acceleration stress screening mean? What is the difference between them and aging testing?

Aging testing is the best method for screening and detecting any high potential faults in its products.