As the core component of optoelectronic conversion, the reliability of optical modules directly determines the operating life and failure rate of communication systems.

The CP testing checklist is determined by the product type, process platform, yield risk, testing cost, customer requirements, and reliability level.

The CP testing site usually consists of three types of core equipment: ATE (Automated Test Equipment), Probe (Wafer Probe), and Probe Card.

The precision of selecting aging equipment directly determines the accuracy of test data, compliance with testing regulations, and the level of product quality control.

Semiconductor manufacturing requires extremely high temperature control accuracy, and temperature fluctuations of 0.1 ℃ may lead to wafer scrap. The corresponding temperature control accessory equipment is a key supporting system to ensure process yield.

Temperature Forcing Systems provides a realistic temperature environment and has become the core precision equipment for the development and mass production verification of domestic computing chips, optical interconnect devices, and computing server modules

The TS580 Temperature Forcing Systems independently developed by ZONGLEN has become an ideal testing tool for various fields such as electronic components, automotive, optical communication, etc.

The core advantage of HAST testing is its "efficiency and speed", which can complete equivalent room temperature risk simulations for months to years within hours to tens of hours.