The temperature of the optical module is a crucial indicator, as it can adversely affect the performance and lifespan of the optical module.

As chips become increasingly complex and integration density rises, precise alignment of molds in FOWLP (Fan-Out Wafer-Level Packaging) or FOPLP (Fan-Out Package-on-Package) processes becomes crucial.

The accelerated aging test for optoelectronic devices and modules is a crucial method to evaluate their long-term reliability and lifespan by simulating extreme environmental conditions to induce potential defects in a short period of time.

Thermal compression bonding requires precise connection between materials (such as chips and substrates, metal bumps, etc.) under high temperature and pressure. Its success is highly dependent on temperature uniformity and control accuracy.

The temperature of optical modules is a very important indicator, which can adversely affect the performance and lifespan of optical modules.

The Thermal Inducing System plays a crucial role in scientific research. Its primary function is to provide and maintain a stable and pure low-temperature environment, which is essential for studying the unique properties and behaviors of substances at low temperatures.

Deep silicon etching technology is the core process for achieving high aspect ratio three-dimensional structure processing in the semiconductor manufacturing field, widely used in the core structures of transistors, storage capacitors, and MEMS manufacturing.

ZONGLEN's Temperature Forcing Systems have demonstrated significant technological advantages in CPO optical module testing, with core performance parameters highly matching the extreme testing requirements of CPO modules.