High-temperature packaged devices are widely used in oil exploration and other extreme environments. Their ultimate temperature cycle reliability is crucial for ensuring long-term stable operation of the devices.

Chiller liquid cooling technology introduces cooling fluid into the interior of servers or cooling modules through direct or indirect contact, achieving efficient heat exchange.

The Temperature Forcing System can simulate extreme temperature change environments, accelerating the exposure of issues such as thermal stress, material expansion mismatch, and soldering defects in high-power laser packaging, providing crucial data support for failure analysis.

Rapid thermal oxidation (RTO) technology, with its second-level response and atomic-level precision, has become a key process in high-end chip manufacturing.

HTOL (High Temperature Operating Life Test) and Burn-in are closely related in semiconductor reliability testing.

The HTRB (High Temperature Reverse Bias) reliability test is an accelerated life test that accelerates the aging of device terminals through dual stress of temperature and electrical stress, thereby activating defects present in the design or manufacturing process of power semiconductor devices.

HBF combines the characteristics of 3D NAND flash memory and High-Bandwidth Memory (HBM) to better meet the needs of AI inference.

The temperature of the optical module is a crucial indicator, as it can adversely affect the performance and lifespan of the optical module.