Thermal compression bonding (TCB) process is a key technology in advanced packaging, which can integrate high-density components such as 3D stacked chips and high bandwidth memory (HBM).

Semiconductor equipment chiller, also known as semiconductor cooler, is a device used in the semiconductor manufacturing process to cool equipment or processes

Integrated circuit testing is the process of verifying the functionality and performance of integrated circuit chips during and after the manufacturing process to ensure their quality and reliability.

In the trend of semiconductor transistor size becoming smaller and chip functionality becoming increasingly complex, system level testing (SLT) has become crucial.

Chip aging test is a method of conducting long-term operation and load testing on chips to simulate the aging situation of chips in actual use.

ATE machines can be divided into four categories based on the type of testing chip: memory testing system, digital circuit testing system, analog circuit testing system, and mixed signal circuit testing system.

Sorting machine and probe station are specialized devices that connect the pins of chips with the functional modules of the testing machine and achieve batch automated testing.

ThermoTST Temperature Forcing Systems can provide corresponding temperature environments for testing machines to perform reliability tests such as power device characteristic analysis, high and low temperature temperature change testing, temperature shock testing, and failure analysis.