The Thermal Inducing System, developed and produced by ZONGLEN, adheres to the fundamental design criteria of speed, precision, and reliability, offering robust temperature testing capabilities. It can achieve temperature conversion from -55℃ to +125℃ in approximately 10 seconds, with an even broader temperature range of -90℃ to +225℃. After extensive multi-condition verification, it meets the requirements of various production and engineering environments. The Thermal Inducing System employs pure mechanical cooling, eliminating the need for liquid nitrogen or any other consumable refrigerants.
     The Thermal Inducing System plays a crucial role in scientific research. Its primary function is to provide and maintain a stable and pure low-temperature environment, which is essential for studying the unique properties and behaviors of substances at low temperatures. Below are some of its main application areas:

1. Materials Science
     Low-temperature physical property characterization: Measuring the resistivity, thermal conductivity, thermal expansion coefficient, specific heat capacity, dielectric constant, ferroelectric/piezoelectric properties, etc. of materials in a low-temperature environment is crucial for understanding the fundamental physical properties of materials and evaluating their applicability in low-temperature environments (such as aerospace and superconducting applications).
     Semiconductor device research: Investigating the performance of semiconductor devices at low temperatures, encompassing carrier mobility, noise characteristics, quantum efficiency, and more. Low temperatures can reduce lattice vibration scattering, enhance device performance, or unveil novel physical phenomena.
     2. Spectroscopy and Microscopy
     Scanning probe microscopes, such as scanning tunneling microscopes and atomic force microscopes, operating at low temperatures can: enhance stability by reducing thermal drift; improve resolution due to reduced thermal noise; and investigate quantum effects, such as observing magnetic flux vortices on the surface of superconductors, charge density waves on the surface of quantum materials, or topological surface states.
     3. Testing of AI and GPU high-power chips
AI chips (such as GPUs and TPUs) can consume over 200W of power in high-computing scenarios, leading to a sharp increase in internal temperature and potential issues such as thermal expansion and electron migration. The high and low temperature shock airflow tester can simulate temperature cycling tests from -40°C to +125°C, verifying the thermal stability and packaging reliability of materials. The heat generated in the core area of high-power chips and the low temperature at the edges can easily lead to functional imbalance. The device utilizes a multi-channel airflow design to focus temperature shock on specific areas (such as -90°C to +300°C), avoiding interference from surrounding components.
     4. Electronics/Electrical Engineering
     Superconducting electronic device testing: Testing the performance parameters (such as noise, sensitivity, quality factor) of superconducting quantum interference devices, microwave filters, antennas, and other devices based on high-temperature superconducting thin films in the liquid nitrogen temperature range.
     Low-temperature electronics characterization: studying the operating characteristics, reliability, and noise behavior of electronic components and circuits under low-temperature environments.

The Thermal Inducing System serves as a crucial bridge connecting the "room temperature world" and the "low temperature world". By simulating extreme low temperature conditions, it provides support for material performance evaluation and reliability testing across multiple industries, significantly advancing the development of various cutting-edge research fields such as materials science, chemistry, electronic engineering, and biology. Especially in high-temperature superconductivity research, it is an indispensable fundamental experimental equipment.

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