Semiconductor manufacturing requires extremely high temperature control accuracy, and temperature fluctuations of 0.1 ℃ may lead to wafer scrap. The corresponding temperature control accessory equipment is a key supporting system to ensure process yield.

Temperature Forcing Systems provides a realistic temperature environment and has become the core precision equipment for the development and mass production verification of domestic computing chips, optical interconnect devices, and computing server modules

The TS580 Temperature Forcing Systems independently developed by ZONGLEN has become an ideal testing tool for various fields such as electronic components, automotive, optical communication, aerospace, etc.

The core advantage of HAST testing is its "efficiency and speed", which can complete equivalent room temperature risk simulations for months to years within hours to tens of hours.

ZONGLEN's self-developed integrated air flow meter is a combined high and low temperature impact air flow meter. The equipment comes with a clean oil-free air source system and does not require additional air compressors; The host and clean oil-free gas source module can be separated to meet the flexible applications of various types in the laboratory.

ThermoJet ES is an airflow jet single point temperature forcing system that does not rely on the overall cooling of the box, but generates controllable ultra-low temperature/ultra-high temperature pure airflow.

High-temperature packaged devices are widely used in aerospace, oil exploration, deep space exploration, and other extreme environments. Their ultimate temperature cycle reliability is crucial for ensuring long-term stable operation of the devices.

Chiller liquid cooling technology introduces cooling fluid into the interior of servers or cooling modules through direct or indirect contact, achieving efficient heat exchange.