The heat dissipation circuit of the power module is through the chip DCB、 The copper substrate, heat sink, welding layer, and thermal grease layer are connected in series.

The reliability evaluation of TFT (Thin Film Transistor) is a comprehensive evaluation process, which is an important link to ensure the quality and stable performance of electronic products such as TFT LCD screens.

CP testing refers to the electrical and functional testing of each chip unit (Die) directly on the wafer before it is cut and packaged.

Integrated circuit testing is a crucial step in ensuring chip quality, with the two main types of testing being CP testing (Chip Probing) and FT testing (Final Test).

The role of probe cards in integrated circuit testing is crucial. It is not only the interface between ATE and wafer, but also an important tool to ensure chip yield and quality.

Parameter testing is usually performed after the wafer manufacturing process is completed (i.e. passivation has been carried out) and before the electrical performance sorting (electrical sorting) of the product bare chips.

Every power chip needs to undergo performance testing, and every wafer needs to undergo screening testing. The screening and testing of wafers must have wafer automation testing fixtures, namely automated high-voltage probe stations, as well as static parameter testing instruments.

In the chip specification sheet, there are three most helpful values for heat dissipation design: power consumption, temperature requirements, and thermal resistance parameters.