The high and low temperature chuck system is a key technology for solving the problem of high power density heat dissipation. Its high efficiency, precision, and reliability make it a core equipment in fields such as semiconductors and advanced manufacturing.

For the environmental temperature and humidity of electronic laboratories, RB/T 047-2020 "General Requirements for Management and Technical Capability Evaluation Facilities and Environment of Inspection and Testing Institutions" does specify the temperature and humidity of laboratories (6.2.1 Environmental Temperature 16-26 ℃, Relative Humidity 30% -65%), but this standard is specific to the entire industry and does not take into account the particularity of electronic laboratories.

In the field of reliability engineering, life acceleration models are a key tool for predicting product life. By selecting appropriate acceleration models, traditional lifespan testing that takes years can be shortened to a few weeks, significantly improving research and development efficiency.

The "85/85" combination is actually a product of long-term industry experience and standard consensus, and it has its scientific and engineering rationality

The post silicon chip testing method refers to the testing conducted after the chip packaging is completed, aiming to test the functionality, performance, and reliability of the chip.

wafer chuck， The wafer chuck is a key component used in semiconductor equipment to fix and support wafers, providing a stable support platform for wafers in various processing techniques, ensuring the positional accuracy and stability of wafers during processing.

As a key component in semiconductor equipment, the performance of wafer chuck directly affects the quality and efficiency of semiconductor manufacturing.

The essential difference between ICP and CCP lies in the energy coupling mode, and the two complement each other in advanced processes.