Temperature Forcing Systems TS560 GPIB communication (IEE488) is perfectly compatible with Huafeng measurement and control, and is easy to operate

Power module is an important component to realize green energy conversion.

Commonly used DFT methods include scan chain-based test methods and built-in self-test circuits.

The wafer test is completed by ATE and Prober; The finished product test is completed by ATE with high and low temperature impact airflow meter.

Failure mechanism of crimping IGBT power module package

Reliability is a measure of product durability.

DFT technology is simply to add DFT logic to the chip design, and then after the chip manufacturing is completed, test the chip through the added DFT logic in advance to select the chip with no problems.