There is a risk that sealed components may be overlooked by the manufacturer during the production process and lead to component failure during subsequent use, which is the excess small loose particles that appear inside the sealed components.

The Precision Temperature Cycling System is widely used in industries such as network communication chips, microelectronic devices, and integrated circuits

Memory chips are responsible for data storage in electronic systems and are the core of semiconductor storage products. Their storage capacity and reading speed directly affect the performance of electronic devices.

Chip testing is almost inseparable from temperature shock testing, and IGBT needs to conduct some environmental reliability tests using a temperature shock testing machine.

Electronic component testing and screening services improve product reliability, especially for imported components. Through "secondary screening", product quality is ensured to be controllable, and overall equipment reliability is improved.

The loss characteristics of IGBT are closely related to temperature, so the loss values at room temperature of 25 ℃ and high temperature of 125 ℃ are calibrated as the basis. Based on the parameters of 25 ℃ and 125 ℃, the loss data in the full temperature range is obtained through linearization processing.

High and low temperature conditions and dwell time Currently, the new specifications require that the surface temperature of the test object be based on, rather than the air temperature in the test area of the test equipment

An irreversible trend in the semiconductor industry is the continuous increase in chip complexity, which puts forward higher requirements for chip testing.