Temperature Forcing Systems are aesthetically pleasing, compact, and portable compared to traditional test boxes. 10 inch hd color touch screen, man-machine interface, easy to operate. Detachable design facilitates maintenance or repair of the internal components of the equipment.

The importance of the Chinacryo Temperature Forcing Systems TS series to chips.

Characteristics of Temperature Forcing Systems

Wafer testing is now an essential part of the wafer manufacturing process. In the early days of semiconductor manufacturing, each chip was tested after it was molded, cut, and packaged.

What are the main categories of semiconductor devices?

One of the reasons why SiC can be used as the raw material of power devices is that it can borrow many famous concepts and technologies of silicon devices.

The high and low temperature impact airflow instrument developed by Intercooling Low Temperature Technology can be used for reliability tests such as characteristic analysis, high and low temperature temperature change test, temperature impact test, failure analysis, etc. For example, IGBT test can also use this airflow instrument.

Signal routing system - all signals on the path between the equipment under test and the test instrument, including switch components and any external connectors and cables.