In the chip design phase, it is necessary to plan the testing content and methods based on the specifications and parameters of each chip.

ThermoTST TS560 temperature test range -70 ℃ to+225 ℃, meeting the operating temperature range of various levels of the AEC-Q100 standard environment.

Chip testing generally involves two major steps, one called CP (Chip Probing) and the other called FT (Final Test). CP is testing for wafers, FT is testing for packaged chips

The ThermoTST Thermal Inducing System recommends performing maintenance and temperature calibration work every 12 months, replacing consumables such as filter cartridges, and the time interval also depends on the application environment and usage time of the equipment.

To establish a stable signal connection relationship between the testing machine and the probe station, it is necessary to temporarily install the tested device on the semiconductor testing device, and execute the test by inputting and outputting test signals between the signal components set on the semiconductor testing device and the tested device

The Semiconductor industry has become an indispensable part of all walks of life. Some common terms and their meanings can better understand the working principles of semiconductor chips

WAT, also known as WAT process control monitoring, is a process that tests the electrical parameters of a specific test structure on a wafer, detects the process condition of each wafer product, evaluates the quality and stability of the semiconductor manufacturing process, and determines whether the wafer product meets the electrical specifications of the process technology platform.

Automotive grade chips are chips used in automobiles, which require higher reliability compared to consumer and industrial grade chips