Automotive grade chips are chips used in automobiles, which require higher reliability compared to consumer and industrial grade chips

After the arrival of Temperature Forcing Systems, five major inspections must be conducted before they can be used with confidence, and the last one is particularly important!

How does the ThermoTST series Thermal Inducing System operate? Three steps to proficiently operate the Thermal Inducing System!

The semiconductor microscope brand has excellent performance, precise analysis, and a wide range of applications.

After the completion of wafer manufacturing, wafer testing is a very important step. During the testing process, the electrical capability and circuit functionality of each chip are detected.

In the manufacturing process of the semiconductor industry, it can be mainly divided into four steps: IC design, wafer manufacturing process, wafer testing, and wafer packaging.

Regarding the packaging structure of power devices, domestic and foreign research institutions and enterprises have conducted extensive theoretical research and development practices in structural design. Multiple structural packaging design concepts have been proposed and studied by domestic and foreign research institutions, and some structural design schemes have been successfully applied to commercial power devices.

Many testing requirements in the reliability testing process of optical communication, chips, integrated circuits, laboratory research and other fields need to be equipped with high and low temperature cycle testing systems