Chip aging test is a method of conducting long-term operation and load testing on chips to simulate the aging situation of chips in actual use.

ATE machines can be divided into four categories based on the type of testing chip: memory testing system, digital circuit testing system, analog circuit testing system, and mixed signal circuit testing system.

Sorting machine and probe station are specialized devices that connect the pins of chips with the functional modules of the testing machine and achieve batch automated testing.

ThermoTST Temperature Forcing Systems can provide corresponding temperature environments for testing machines to perform reliability tests such as power device characteristic analysis, high and low temperature temperature change testing, temperature shock testing, and failure analysis.

Both HTOL and LTOL testing are aimed at accelerating the aging process of integrated circuits under extreme temperature conditions, in order to quickly identify potential failure modes.

In the field of reliability testing, there are many common English abbreviations and their corresponding descriptions.

Atomic Layer Etching (ALE) is a high-precision etching technique that can be regarded as the reverse process of Atomic Layer Deposition (ALD).

The heat dissipation circuit of the power module is through the chip DCB、 The copper substrate, heat sink, welding layer, and thermal grease layer are connected in series.