CP testing refers to the electrical and functional testing of each chip unit (Die) directly on the wafer before it is cut and packaged.

Integrated circuit testing is a crucial step in ensuring chip quality, with the two main types of testing being CP testing (Chip Probing) and FT testing (Final Test).

The role of probe cards in integrated circuit testing is crucial. It is not only the interface between ATE and wafer, but also an important tool to ensure chip yield and quality.

Parameter testing is usually performed after the wafer manufacturing process is completed (i.e. passivation has been carried out) and before the electrical performance sorting (electrical sorting) of the product bare chips.

Every power chip needs to undergo performance testing, and every wafer needs to undergo screening testing. The screening and testing of wafers must have wafer automation testing fixtures, namely automated high-voltage probe stations, as well as static parameter testing instruments.

In the chip specification sheet, there are three most helpful values for heat dissipation design: power consumption, temperature requirements, and thermal resistance parameters.

Packaging and testing play a crucial role in the field of integrated circuits. It can be divided into four stages: wafer testing, chip packaging, chip final testing, and system level testing.

Contact type high and low temperature impact machine can meet the requirements of live testing under high or low temperature conditions. The system can provide fast and accurate temperature conversion on the IC.