Types and testing conditions of wafer temperature cycle reliability testing

Wafer back cooling technology, as an effective temperature management method, not only ensures the uniformity of wafer temperature, but also enhances the stability during wafer processing.

HASS, also known as high acceleration stress screening experiment, aims to ensure that the produced product does not have any hidden defects or to find and solve these defects before the product leaves the factory

Temperature deviation: Under the stable state of ThermoChamber, the deviation between the measured maximum and minimum temperatures of each measuring point in the working space and the set temperature within the specified time.

The goal of waste gas treatment devices is to reduce the concentration of harmful substances in waste gas, ensure that emissions comply with environmental regulations and standards, and protect the environment and human health.

There are two main types of vacuum suction cups: non hot chuck and hot chuck. The heat card has an overall heating or cooling function, which can maintain the wafer at a specific temperature during the processing.

The significance of TC high-temperature cycling test is to confirm the effect of mechanical stress on the welding performance of devices at extremely high temperatures, extremely low temperatures, and alternating high and low temperatures

With the reduction of design rules, many etching processes have shifted towards very fast plasma etching process steps, which require highly precise control of all reaction inputs.