ATE (Automatic Test Equipment), also known as semiconductor automated testing machine or semiconductor automated testing system. The semiconductor testing machine tests the circuit functions and electrical performance parameters of semiconductor devices, including DC parameters (voltage, current), AC parameters (time, duty cycle, total harmonic distortion, frequency, etc.), functional testing, etc.
Integrated circuit testing runs through the core processes of integrated circuit design and production, as follows:
The design process of integrated circuits requires chip validation, which involves verifying the effectiveness of wafer samples and integrated circuit packaging samples;
2. The production process includes wafer manufacturing and packaging testing. In these two stages, defects such as functional failure and performance degradation of integrated circuits may occur due to imperfect design, manufacturing process deviations, wafer quality, environmental pollution, and other factors. Therefore, wafer probing (CP) and finished product testing (FT) need to be completed separately. By analyzing the test data, the specific cause of failure can be determined, and the design, production, and packaging testing processes can be improved to increase yield and product quality. Regardless of the stage, two steps must be completed to test the various functional indicators of the chip: first, connect the pins of the chip to the functional modules of the testing machine; second, apply input signals to the chip through the testing machine and detect the output signals to determine whether the chip's functions and performance meet the design requirements.
The main functions of the testing machine are:
Due to the increasing number of integrated circuit parameter items, such as voltage, current, time, temperature, resistance, capacitance, frequency, pulse width, duty cycle, etc., there is a growing demand for functional modules in testing machines;
Customers have increasingly high requirements for integrated circuit testing accuracy (microvolt, microampere level accuracy), such as increasing the clamp accuracy of testing machines from 1% to 0.25% and time measurement accuracy to microsecond level. The requirements for testing machine testing accuracy are becoming more stringent;
As the application of integrated circuits becomes more and more widespread, the demand is increasing, and the requirements for testing costs are becoming higher. Therefore, the requirements for testing speed of testing machines are becoming higher and higher (such as the requirement for source response speed to reach microsecond level);
The increase in the categories of integrated circuit products requires testing equipment to have a universal software development platform, which facilitates customer secondary application development to meet the testing needs of different products;
The testing equipment supplier has put forward high requirements for the data storage, collection, and analysis of the testing machine in terms of equipment status, testing parameter monitoring, and production quality data analysis, combined with the application of big data.
At different testing stages of the testing machine, different temperature environments are required. The ThermoGST heat flow meter can provide corresponding temperature environments for the testing machine, and can be used in conjunction with the testing machine to perform reliability tests such as power device characteristic analysis, high and low temperature change testing, temperature shock testing, and failure analysis. ThermoGST heat flow meter has a wider temperature range of -80 ° C to+225 ° C, with a temperature conversion time of about 10 seconds from -55 ° C to+125 ° C; After long-term multi condition verification, it meets the requirements of various production and engineering environments. ThermoGST heat flow meter is a pure mechanical refrigeration system that does not require liquid nitrogen or any other consumable refrigerants.
The characteristics of ThermoGST heat flow meter include:
The temperature change rate is fast, with a conversion time of about 10 seconds between -55 ℃ and+125 ℃
Effective temperature range, -80 ℃ to+225 ℃
Compact structure, mobile design
Touch screen operation, human-computer interaction interface
Fast DUT temperature stabilization time
Temperature control accuracy ± 1 ℃, display accuracy ± 0.1 ℃
The airflow can reach up to 18SCFM
Defrosting design, quickly removes internal water vapor accumulation