Performing aging tests to replicate the actual on-site stress environment can help reduce failure rates. Aging testing is crucial for ensuring quality control of the production line.

The most direct way to verify the working life of a product is to directly simulate the actual working environment it is subjected to and observe its normal working time.

SOC testing is a crucial step in ensuring the quality and performance of chips. With the improvement of SOC integration, the complexity of testing has also significantly increased, requiring more testing vectors and time.

The JEDEC standard is widely used in the design, manufacturing, and reliability testing processes of semiconductor chips, integrated circuits, and other electronic devices.

The basic principle of integrated circuit testing is to apply excitation to the chip through test vectors, measure the chip's response output, and compare it with the predicted results in advance.

Electrostatic chuck is a typical segmented component market that plays an important role in multiple aspects of semiconductor manufacturing processes.

The key to HBM manufacturing is the TSV process, which aims to drill holes on the chip. This can reduce resistance and accelerate data transmission speed.

Electrostatic discharge (ESD) should be the main culprit causing electrical over stress (EOS) damage to all electronic components or integrated circuit systems.