Product reliability testing is an important part of product quality assurance, including pre con, aging, and ESD. JEDEC standards are widely used in the design, manufacturing, and reliability testing processes of semiconductor chips, integrated circuits, and other electronic devices. What are the specific reliability standards?

JEDEC JESD22 Reliability Testing Standard Set

JEDEC JESD22-A100E：2020 Cycled Temperature-Humidity-Bias with Surface Condensation Life Test 

JEDEC JESD22-A101D.01：2021 Steady-State Temperature-Humidity Bias Life Test

JEDEC JESD22-A102E：2015(R2021) Accelerated Moisture Resistance - Unbiased Autoclave 

JEDEC JESD22-A103E.01：2021 High Temperature Storage Life

JEDEC JESD22-A104F ：2020 Temperature Cycling

JEDEC JESD22-A105D：2020 Power and Temperature Cycling

JEDEC JESD22-A106B.01：2016 Thermal Shock

JEDEC JESD22-A107C：2013 Salt Atmosphere

JEDEC JESD22-A108F：2017 Temperature, Bias, And Operating Life

JEDEC JESD22-A109B：2011 HERMETICITY

JEDEC JESD22-A110E.01：2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) 

JEDEC JESD22-A111B ：2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices

JESD22-A113I：2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing 

JEDEC JESD22-A117E：2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test

JEDEC JESD22-A118B.01：2021 Accelerated Moisture Resistance - Unbiased HAST

JEDEC JESD22-A119A：2015 Low Temperature Storage Life

JEDEC JESD22-A120C：2022 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices 

JEDEC JESD22-A121A(R2019) Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes

JEDEC JESD22-A122A：2016 Power Cycling

JEDEC JESD22-B100B：2003 Physical Dimensions

JEDEC JESD22-B101C：2015 External Visual

JEDEC JESD22-B102E：2007 Solderability

JEDEC JESD22-B103B.01：2016 Vibration, Variable Frequency

JEDEC JESD22-B105E：2018 Lead Integrity

JEDEC JESD22-B106E：2016Resistance to Solder Shock for Through-Hole Mounted Devices 

JEDEC JESD22-B107D：2011 Mark Permanency

JEDEC JESD22-B108B：2010 Coplanarity Test for Surface-Mount Semiconductor Devices

JEDEC JESD22-B109C：2021 Flip Chip Tensile Pull

JEDEC JESD22-B110B.01：2019 Mechanical Shock – Device and Subassembly

JEDEC JESD22-B111A：2016 Board Level Drop Test Method of Components for Handheld Electronic Products

JEDEC JESD22-B112B ：2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

JESD22-B113B：2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products

JEDEC JESD22-B114B：2020 Mark Legibility

JEDEC JESD22-B115A.01：2016 Solder Ball Pull

JEDEC JESD22-B116B：2017 Wire Bond Shear Test Method

JEDEC JESD22-B117B：2014 Solder Ball Shear

JEDEC JESD22-B118A：2021 Semiconductor Wafer and Die Backside External Visual Inspection

JEDEC JESD22-B119：2018 Mechanical Compressive Static Stress Test Method

ANSI/ESDA/JEDEC JS-001-2017 Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) -Component Level

JEP70C：2013 Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware

JEDEC JEP176：2018 ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES

JEDEC JEP180.01：2021 Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices 

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