With the development of technology, System on Chip (SOC) has become the core component of electronic devices. From smartphones to automotive electronics, SOC is ubiquitous. However, ensuring the reliability and performance of these chips in practical applications requires complex and rigorous testing.
SOC (System on Chip) is a system level ultra large scale integrated circuit that integrates multiple functional modules such as CPU, memory, and I/O interfaces on a single chip. SOC testing is an important step in ensuring that these integrated circuits can operate normally in manufacturing and practical applications. It not only includes testing of digital circuits, but also covers multiple aspects such as analog circuits, memory, power consumption, electromagnetic interference, etc.
SOC testing is usually divided into the following categories:
1. Digital circuit testing:
·Scan Test (SCAN): Transform internal triggers into observable nodes through a scan chain.

·Automatic Test Vector Generation (ATPG): Generate test vectors that can detect all potential faults in the circuit.
·Logic Built in Self Testing (LBIST): Using internally generated pseudo-random test vectors to self test logic circuits.

2. Analog circuit testing:
·DC testing: detecting DC parameters such as input/output voltage and current.
·Simulate multiplexer (MUX) testing: Perform multiplex selection testing on analog-to-digital interface signals.
3. Memory testing:
·Built in self-test (MBIST): Conduct self-test on internal faults of memory such as RAM and ROM.
·Memory bypass mode test: Use bypass mode to perform overlay testing on the memory during basic scan testing.

4. IO testing: Testing IO through Boundary scan
·JTAG protocol: Implement board level interconnect testing and chip internal IP debugging through IEEE 1149 standard.
·Boundary Scan Register (BSR): Insert a scan register into the input and output pins of the chip to achieve controllable and observable test signals.

5. Power consumption test:
·Static current (IDDQ) test: measures the current of the chip under static conditions to detect leakage current and short circuit faults.
·Low power mode test: Measure the current consumption of the chip in different low power modes.
6. Electromagnetic interference test:
·Electrostatic Discharge (ESD) Testing: The chip's tolerance to static electricity is tested using methods such as Human Discharge Model (HBM) and Machine Discharge Model (MM).
SOC testing is a crucial step in ensuring the quality and performance of chips. With the improvement of SOC integration, the complexity of testing has also significantly increased, requiring more testing vectors and time. Testing costs account for a large proportion of chip manufacturing costs, and it is necessary to optimize testing processes and technologies to reduce costs. With the popularization of low-power design, it is necessary to test different power consumption modes to ensure the performance of chips in low-power mode. With the development of technology, SOC testing will continue to advance, providing more efficient and reliable guarantees for chip manufacturing.

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