IGBT is a high-voltage, high current power semiconductor device commonly used in high-power applications such as electric vehicles, industrial motor drives, UPS, etc.

The main performance indicators reflected by the optical module on the single board collectively determine the performance and applicability of the optical module

Immersion liquid cooling refers to immersing heating electronic components (such as CPUs, GPUs, memory, and hard drives) in refrigerant (coolant), relying on liquid flow circulation to remove heat.

Photonic Integrated Circuit (PIC) is a circuit that utilizes the principles of photonics to achieve efficient information transmission and processing under conditions of high speed, large bandwidth, and low energy consumption.

Wafer back cooling basically uses helium gas for cooling, because helium gas in the gas phase has outstanding chemical inertness, and its thermal conductivity and specific heat capacity are greater than any other gas except hydrogen gas.

The sharp increase in energy consumption of optical modules has brought enormous pressure to the cost side of data centers, and solving its energy consumption problem has become the key to the current update of optical module technology.

Temperature cycling test, temperature shock test, and thermal shock test are used to simulate and evaluate the performance of optical modules under high and low temperature shocks.

The AEQ quality standard is one of the most relevant standards for automotive electronics in the automotive industry. AEC-Q100 is a failure mechanism based on stress testing of packaged integrated circuits.