One of the reasons why SiC can be used as the raw material of power devices is that it can borrow many famous concepts and technologies of silicon devices.

The high and low temperature impact airflow instrument developed by Intercooling Low Temperature Technology can be used for reliability tests such as characteristic analysis, high and low temperature temperature change test, temperature impact test, failure analysis, etc. For example, IGBT test can also use this airflow instrument.

Signal routing system - all signals on the path between the equipment under test and the test instrument, including switch components and any external connectors and cables.

With the improvement of SiC MOSFET fabrication technology and the solution of driving problems, it will be widely used in the field of high frequency switching in power electronics.

ThermoStream TS-760 is used to test MCU/SoC microprocessor chips

Chinacryo ThermoStream TS series can be used with advantest, Teradyne, Verigy, Keysight instrument, semiconductor chip high and low temperature testing. Semiconductor chip temperature test is mainly to do chip temperature shock and temperature cycle test.

The ThermoTST TS series high and low temperature tester of Chengdu Chinacryo Technology can be used with the LCD measurement system to test the LED ambient temperature.

It is very important to test the stability of the power supply chip in the process of rapid temperature change.Chinacryo ThermoTST provides a fast impact temperature range of -100°C to +350°C to meet the high and low temperature impact test of all kinds of PMIC power management chips.