Integrated circuit testing is the process of verifying the functionality and performance of integrated circuit chips during and after the manufacturing process to ensure their quality and reliability. Integrated circuit testing is an important part of the integrated circuit manufacturing process, which ensures the quality and reliability of integrated circuits, meets customer needs, and promotes the development and innovation of integrated circuit technology. Understanding and conducting integrated circuit testing is crucial for ensuring the quality and reliability of integrated circuits, while also helping to enhance product competitiveness and market value.
ic test
IC (Integrated Circuit) testing is located at a critical node in the industry chain, running through the entire process of design, manufacturing, packaging, and application. From the perspective of the entire manufacturing process, integrated circuit testing specifically includes design verification in the design phase, process inspection in the wafer manufacturing phase, wafer testing before packaging, and finished product testing after packaging. It runs through the entire process of design, manufacturing, packaging, and application, and plays an important role in ensuring chip performance and improving the efficiency of the industrial chain operation.
IC testing is an important part of ensuring product yield and cost control. The main purpose of testing is to ensure that chips can fully achieve the functions and performance indicators specified in the design specifications in harsh environments. Each test will generate a series of test data, which can not only judge whether the chip performance meets the standards, but also fully and quantitatively reflect various indicators of each chip from structure, function to electrical characteristics from the detailed data of the test results.
Advanced packaging testing
Advanced packaging adopts processes such as bump bonding and uses flip chip bonding instead of traditional wire bonding. By shortening the interconnection distance and increasing the 1/O density, it has higher storage bandwidth and better heat dissipation efficiency. At the same time, the encapsulated objects have evolved from single die to multi die, and chip combinations have also evolved from single type and planar layout to multifunctional and three-dimensional stacking, significantly improving the utilization of packaging space and chip system performance.
The advanced packaging testing solution mainly focuses on two aspects: structured testing and system level testing. Structured testing, which refers to testing for internal defects of chips, is commonly used as Scan testing. System level testing is aimed at the overall chip and the interaction between IP cores, and is the testing of the chip in its application working mode.
On chip System SoW Testing
Compared to traditional chips, the measurability and testing techniques of SoW on chip systems face many new challenges. The manufacturing yield of SoW needs to consider two parts: the yield of a single chip itself and the yield of the multi-core packaging process. To ensure the yield of SoW in the on-chip system, it is necessary to conduct defect testing on each chip and yield testing on the chip packaging process. If defective chips are integrated on the substrate or defects are generated during the packaging process, the entire on-chip system SoW will not be able to achieve the expected function.
Testing of On Crystal System SoW It needs to be carried out from two aspects: testing technology for single core particles and testing technology for packaging and interconnection. The testing technology for single core particles is carried out by using a probe station combined with the DFT (Design for Testing) structure of a single core particle. The testing technology for encapsulated interconnects requires research on the testability design of parallel transmission bus structures and redundant design at the interconnect level, as well as the design of online interconnect repair mechanisms and data transmission protocol repair mechanisms. Dynamically reconfigure the data sending and receiving ports based on the mode of fault occurrence to ensure the correctness of interface functionality and timing.

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