In addition to the combined cycles of high temperature, low temperature, high temperature, high humidity, and temperature and humidity, reliability environmental testing is also a common test item. The purpose of cold and hot impact testing is to identify product design and process defects through severe temperature changes that exceed the natural environment (temperature variability greater than 20 ℃/min, and even up to 30 to 40 ℃/min), but there are often situations where temperature cycling and temperature impact are confused. Temperature cycle refers to the process of changing temperature at high and low temperatures, and the rate of change of temperature can be specified and controlled; The temperature change rate of the high and low temperature airflow impact is not specified, while the high and low temperature airflow impact is a rapid temperature change within a specified transition time; Medium: Air, The main parameters of high and low temperature airflow impact are: high and low temperature conditions, dwell time, reset time, and number of cycles. In high and low temperature conditions and dwell time, the current new specifications will require that the surface temperature of the test article, rather than the air temperature in the test area of the test equipment, be based on.

High and low temperature airflow impact system: It is used to test the endurance of a material structure or composite material under extreme high and low temperature continuous environments in an instant, so as to test its chemical changes or physical damage caused by thermal expansion and contraction in the shortest time. Applicable objects include metal, plastic, rubber, electronics, etc Such materials can be used as a basis or reference for product improvement.

Features of the high and low temperature airflow impact system developed by Intercooler:

Fast temperature change rate, switching from - 55 ℃ to+125 ℃ for about 10 seconds

Effective temperature range, - 70 ℃ to+225 ℃

Compact and mobile design

Touch screen operation, human-computer interaction interface

Fast DUT temperature stabilization time

Temperature control accuracy ± 1 ℃, display accuracy ± 0.1 ℃

Air flow can be up to 18SCFM

Defrosting design for rapid removal of internal moisture accumulation

Intelligent touch screen interface intelligent design, multi color touch screen, making the system easy to set up and operate. The display of temperature settings, air temperature, DUT (device under test) temperature, airflow rate, and current system status continuously promotes real-time status. There are various menus that allow the operator to change parameters by touching the desired selection. In addition, the password protection function enables test engineers to determine operator access to critical software components.

Applied to reliability tests such as product characteristic analysis, high and low temperature temperature variation testing, temperature impact testing, and failure analysis, such as:

Chips, microelectronic devices, integrated circuits

(SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.)

Flash, UFS, eMMC

PCBs, MCMs, MEMS, IGBT, sensors, small module components

Optical communication (such as transceiver high and low temperature test, SFP optical module high and low temperature test, etc.)

Other electronic industries, aerospace new materials, laboratory research