Equipment for failure analysis

After removing the surface passivation layer, metallized layer and interlayer medium, the failure point can not be observed sometimes. At this time, the chip needs to be further treated, and the dry etching or wet etching of the chip for multi-layer wiring shall be removed one by one until the last metallized and dielectric layer. After playing with all the metallized layers and dielectric layers, sometimes it is necessary to remove the polysilicon layer, oxide layer, etc. until the silicon body is exposed.

Since the materials of the interlayer medium are basically the same as those of the passivation layer, the removal of the interlayer medium is also similar, which is mainly divided into dry corrosion and wet corrosion. It is worth noting here that, taking the high and low temperature impact equipment TS-580 in Chengdu as an example, it can provide reliability tests such as characteristic analysis, high and low temperature temperature change test, temperature impact test and failure analysis.

Application of Precision Temperature Cycling System

Precision Temperature Cycling System is now very active in the field of cold and hot testing of electronic components/modules. Because it is stable in constant temperature testing, and can be stably maintained at a certain temperature point. The accuracy can reach ± 1 ℃; The speed of temperature change during temperature impact: - 55 ℃~+125 ℃ ＜ 10 seconds; Really achieve the purpose of temperature "shock"; The temperature change time is controllable and the operation is programmable.

At present, the high and low temperature impact equipment TS-580 is mainly used in the following aspects:

Chips, microelectronic devices, integrated circuits (SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.)

Flash, UFS, eMMC

Optical communication of PCBs, MCMs, MEMS, IGBT, sensors, small module components (such as high and low temperature test of transceiver, high and low temperature test of SFP optical module, etc.)

Other electronic industries, new aerospace materials, laboratory research.

1. The output air flow hood of the testing machine will be covered by the tested object to form a test chamber in a relatively closed space. The high temperature or low temperature air flow output by the testing machine will dramatically change the surface temperature of the tested object, thus completing the corresponding high and low temperature impact test;

2. A single IC or other components among many components can be isolated for high and low temperature impact without affecting other components around. Compared with the traditional cold and hot impact test chamber, the impact rate of temperature change is faster.