In semiconductor technology, in order to create micro devices inside the chip, a thin film thickness of less than 1 μ m is required. Such thin films cannot be manufactured through ordinary mechanical processing, and can only be covered on the wafer surface by physical spraying or chemical reactions containing the required molecules or atoms. "Thin film deposition" refers to continuously depositing layers of thin films and removing excess parts through etching, and adding some materials to separate different wafer devices.
Common thin film deposition methods include physical vapor deposition (PVD), chemical vapor deposition (CVD), solution deposition, and atomic layer deposition (ALD).
① PVD (Physical Vapor Deposition): refers to the technique of using physical methods to vaporize the surface of a material source (solid or liquid) into gaseous molecules, atoms, or partially ionize into ions under vacuum conditions, and depositing a continuous thin film on the substrate surface through a low-pressure gas (or plasma) process. It is widely used in fields such as semiconductors and electronics.
② CVD (Chemical Vapor Deposition): By heating one or more gases (known as precursors) to undergo chemical decomposition, reaction products are produced and deposited on the surface of semiconductors to form the desired thin film, which is used to deposit dielectric insulating layers, semiconductor materials, metal thin films, etc.
③ ALD (Atomic Layer Deposition): It is a high-precision thin film deposition technology based on chemical vapor deposition, which allows material to be deposited layer by layer on the substrate surface in the form of a single atomic film based on chemical vapor deposition. It can be used for the deposition of dielectric, insulating, and metal thin films.
During the thin film deposition process, a high-temperature environment is usually formed, which causes the deposition equipment to malfunction and affects the deposition effect and stability. At this time, professional temperature control equipment is needed for cooling management. The chiller can remove the heat generated during the sedimentation process by providing cooling water, ensuring that the equipment temperature is at a stable value, improving sedimentation efficiency and quality, and ensuring the stable operation of the sedimentation system.
The Chiller ZC209 independently developed by Zonglen is a device that controls the temperature of circulating fluid and outputs cold and hot fluids. It has rich functions such as high temperature stability, wide temperature range, fault self diagnosis, and external communication. Adopting advanced refrigeration and temperature control technology, it has a wide temperature range: -20 ℃ to+90 ℃, with a temperature accuracy of ± 0.5 ℃. It is widely used in industries such as semiconductor manufacturing processes, laser processing machines, analysis devices, LCD manufacturing devices, and metal mold temperature control.
Chiller ZC209 is mainly used in semiconductors, lasers FPD， For example: semiconductor (etching equipment, thin film deposition, CMP, coating machine/developing machine, testing machine, cleaning machine)
Laser (laser processing machine, laser welding machine, laser, fiber laser transmission cable joint, ultrasonic inspection device, secondary battery manufacturing engineering)
It can be applied to a wide range of industries, such as pharmaceuticals, chemicals, new energy, semiconductors, laboratories, universities, and other fields.

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