Probe station is a wafer probe testing equipment, which plays an important role in the semiconductor device manufacturing process. Through probe testing, abnormal grains in the wafer can be detected in a timely manner, reducing the processing cost of subsequent processes.
The probe station moves the Chuck station through the XYZR four axis motion platform to accurately align and contact the solder pads on the grains. Then drive the testing machine to apply the testing program to the tested grain through the probe. After the testing machine completes the test, it returns the results to the probe station control program. The probe station stores the test results and marks the grains accordingly based on the results.
Composition of probe station testing system
Probe testing systems can be roughly divided into two categories: probe stations and testing systems, with the probe station consisting of four parts: industrial computer, position control module, image acquisition module, and I/O module.

Position control module: This module mainly consists of a motion control card (such as Omron's CK3M), a four axis motion platform, four control motors and drivers, and some photoelectric switches.
The four axis motion platform is the main mechanical structure of the automatic probe table, used to achieve the horizontal movement, lifting, and rotation of the bearing platform.
The horizontal movement of the X-axis is mainly used to accurately move the wafer table to the next testing position and achieve grain feed;
The Y-axis is mainly used for grain wrapping during the testing process;
The Z-axis mainly controls the height of the wafer stage, controls the contact and separation between the probe and the grain solder pad, and can also control the precision focusing of the CCD;
The R axis can rotate within a certain range and is mainly used for angle adjustment to ensure that the arrangement of grains on the support plate is in the same direction as the X or Y axis.
I/O module: Its function is to collect signals from external sensors or output control signals from peripheral auxiliary devices. The input signals mainly include jog control handle, edge detector signal, end of test signal EOT, etc; The output signals mainly include the START signal for starting the test, the TTL result of the test, control signals for vacuum suction cups, buzzers, and alarm lights.
Image acquisition module: Its function is to collect image data of wafers and grains. The upper computer automatically recognizes the center position of the wafer based on corresponding digital image processing algorithms, achieves template matching of grains, and calculates the arrangement direction of grains on the Chuck table.
Testing module: mainly composed of testing machines (such as V93000, etc.), probes, and other components. The testing machine receives control commands such as START (start test) and EOT (end test) from the upper computer according to a specific communication protocol, applies test programs to the probes, obtains test results, and sends them to the upper computer.

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