The chip packaging testing stage aims to provide necessary mechanical and physical protection for chips by precision cutting, wire bonding, and plastic packaging processes on wafers that meet quality standards. Testing tools are used to conduct comprehensive and rigorous functional and performance testing on the packaged chips. Packaging and testing play a crucial role in the field of integrated circuits. It can be divided into four stages: wafer testing, chip packaging, chip final testing, and system level testing.

1. Wafer testing
Before further processing, integrated circuit wafers must undergo rigorous testing to ensure the functional integrity of the die. The process of testing by connecting the pad pins of the grains through probes is called CP testing, which is crucial for ensuring the quality of the final product.
CP testing mainly relies on equipment and testing components such as ATE testing machines, probe stations, and test probe cards. These devices and components work together to gradually complete the testing and verification of Die for each grain on the wafer. For problematic Dies, they are usually marked on their surface using methods such as "Ink" to facilitate selection and identification during subsequent packaging production processes.
2. Chip Assembly
By conducting CP testing on IC wafers, subsequent packaging and production of functional grains can effectively avoid the cost loss caused by packaging defective chips. The chip packaging process varies significantly depending on the packaging form of the final product chip.
In the process of manufacturing the final chip, the substrate (SUB) plays a crucial role. It is a special type of printed circuit board (PCB), whose key function is to extend and connect the Pad pins of die chips to the Ball pins after packaging. Therefore, SUB must be designed and manufactured based on the specific situation and packaging size of each chip.
After packaging is completed, the chip will undergo strict quality inspection. After a series of meticulous packaging processes, the original wafer die is ultimately transformed into finished chip chips, laying a solid foundation for subsequent applications.
3. Final Test of Chip
Before the chip is officially shipped and delivered to end product customers, it must go through an important testing process - Final Test, which can effectively identify and eliminate potential quality issues. FT testing relies on ATE automatic testing equipment. In addition, auxiliary tools such as a test board (Loadboard) and a sorting machine (Handler) are also required. These devices and tools together ensure the accuracy and efficiency of FT testing, providing solid quality assurance for the final shipment of chips.
4. System level testing (SLT Test)
With the increasing size, functionality, and packaging technology of chips, their complexity is also constantly growing, which has led to a significant increase in the cost of CP and FT testing, and faces the problem of limited testing coverage. In order to effectively reduce the shipment defect rate, i.e. DPPM (Million Chip Failure Rate), many chips have added additional SLT testing (system level testing) after completing FT testing.
The design of SLT testing is based on the actual application scenarios of chips. By carefully creating test boards and developing testing processes, we strive to simulate the real chip business flow during the testing process. Through strict inspections that are closer to the "actual application scenarios", we aim to reduce the DPPM defect rate to a lower level. This measure not only improves the quality of chips, but also enhances customers' confidence in the product.
Chip packaging and testing is an important link in the semiconductor integrated circuit industry chain, which is crucial for the physical shell protection, functional integrity, and performance reliability of integrated circuit chips. With the rapid development of technology, future packaging and testing technologies will continue to move towards miniaturization, high density, and high integration. These innovative technologies enable chips to achieve more diverse functions and excellent performance in a more compact space, thereby meeting the growing demand for chips in diverse application fields such as artificial intelligence, the Internet of Things, 5G communication, and automotive electronics. This not only promotes the vigorous development of the semiconductor integrated circuit industry, but also injects new vitality and opportunities into the entire technology industry.

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