As the semiconductor industry receives more and more attention, the semiconductor industry chain is also active. Especially in the global chip capacity is tight, the development of semiconductor equipment market has become the focus of the industry.

From the perspective of the whole semiconductor equipment market, semiconductor equipment is located in the upstream of the industrial chain, and its market size often fluctuates with the technological development and market demand of the downstream semiconductor. According to SEMI, the global semiconductor equipment market will reach a record us $68.9 billion in 2020, up 16% year-on-year, and us $71.9 billion in 2021, up 4.4% year-on-year, and us $76.1 billion in 2022, up 5.8%.

China's semiconductor equipment market is expected to grow 34.6% year-on-year to $18.1 billion by 2020, becoming the world's largest semiconductor equipment market, SEMI said. At the same time, semiconductor equipment as an important part of the semiconductor industry, the demand for localization is also rising.

In the whole chip manufacturing and testing process, passes through the hundreds of thousands of processing procedures, rough, it involves the device type, mainly divided into first after the segmentation and can draw thousands of different machines, accounts for the relatively large market share, mainly has the first crystal pulling: crystal growth equipment, segmentation, CMP polishing machine, etc.; Fab: photolithography machine, etching machine, film deposition equipment, ion injection machine, etc. Back packaging: bonding machine, testing machine, sorting machine, etc.

From the development of domestic semiconductor equipment in recent years, under the strong support of domestic equipment enterprises in the policy and capital, domestic semiconductor equipment manufacturers have made great breakthroughs in the front and back, and continue to make breakthroughs in etching, thin film deposition, testing and other fields -- according to deppon Securities research report shows, Zhongwei And NaURA have made breakthroughs in THE field of CCP and ICP etching equipment respectively, and some products have entered advanced production lines for verification. Naura achieved a breakthrough in the PVD field of domestic high-end film preparation equipment zero, the equipment covers a number of 90-14nm process, Shenyang Tuojing CVD equipment successfully entered the Yangtze River storage production line. Huafeng measurement and control simulation test machine has accounted for 60% of the domestic market, and the subsequent SOC project promotion may bring new growth space for the company.

But in addition to these widely known semiconductor equipment, reliability testing equipment is also an important link in the development of semiconductor industry. It is understood that reliability testing equipment can simulate the environment and through testing to ensure that products meet the quality objectives expected in the development, design and manufacturing. On the one hand, this detection method can ensure the quality of enterprise products, but also enhance the competitiveness of enterprise products in the market.

Among them, the temperature of the semiconductor test system is also an important part of environment reliability test, the media reported that semiconductor temperature testing system for domestic provide related equipment enterprises, have larger growth, after waiting for factory to end, the corresponding IC design, wafer manufacturing and processing, testing and other related enterprises began to run, Semiconductor temperature testing systems will also see new demand growth.

Specifically, as previously reported in the Electronic Engineering album, there are currently three main applications of temperature testing in wafer testing:
1. According to Arrhenius' equation principle, the semiconductor industry recognizes that temperature can be used to estimate the Life of equipment. Therefore, temperature testing is used to determine the high-temperature Operating Life (HTOL:High-temperature Operating Life).

2. Equipment for specific purposes, such as space, outdoor and automotive applications, need to withstand harsher environments and a wide temperature range. For example, all automotive chips typically need to be tested in the range of -40℃ to +150℃.

3. Electronic testing of high-voltage chips (e.g., high-performance microprocessors) and massively parallel testing (DRAM and NAND chips) are recognized challenges in the industry, requiring rapid and effective cooling to avoid burning out the chips.

In addition, temperature testing is becoming more and more important in the packaging field, especially with the advent of advanced packaging, back-end temperature processing has become a hot topic. While domestic and foreign manufacturers are scrambling to seek new growth points in the field of advanced packaging, it also means that the related temperature testing equipment will usher in new opportunities.

 Chengdu ChinaCryo Technologies CO.,LTD. (chinacryo) is an innovative high-tech company focusing on ultra-low temperature solutions. The company was founded in 2019, formerly known as the cryogenic division of Siyang company (intest thermal; SP scientific; polycold System Asia Pacific Service Division). The company mainly produces high and low temperature impact airflow instrument (heat flow instrument), contact high and low temperature impact machine, high and low temperature cold and hot platform Ultra low temperature refrigerator, high and low temperature circulation box, high and low temperature impact box and environmental simulation warehouse provide a complete set of temperature environment solutions for reliability testing in IC chip, 5g communication, optical module, integrated circuit, aerospace, astronomical detection, battery pack, hydrogen energy and other fields. The technical center located in Chengdu headquarters is more than 3000 square meters, and has offices in Tianjin, Shanghai, Shenzhen, Wuhan and Zhuhai. The average industry experience of the members of the company's core technical team is more than 12 years, and more than 40% of the engineers have senior professional titles. More than 30% of engineers with working experience in foreign enterprises. The self-developed high and low temperature impact airflow instrument (heat flow instrument), contact high and low temperature impact machine and ultra-low temperature refrigerator are in a leading position in the world, exported to European, American and Southeast Asian companies, and have high popularity and recognition in the industry; The company has a number of invention patents, copyrights and trademarks, won a number of awards from the government and science and technology departments, and successively carried out project cooperation with well-known scientific research institutes and enterprises.

Chinacryo has launched a series of products for the on-line test of three temperature performance in the chip field of semiconductor industry:

In the early stage, temperature forcing systems relied on imports from the United States for a long time. In this case, chinacryo launched ts-780, which has been applied in many domestic customers and Chinese foreign-funded enterprises for a long time, and can realize complete domestic substitution in performance. Ts-780 has very advanced temperature testing capability. The system temperature conversion rate from - 55 ℃ to + 125 ℃ takes only 10 seconds, and has a very wide temperature range from - 80 ℃ to + 225 ℃; Similarly, the system is pure mechanical refrigeration without liquid nitrogen or any other consumable refrigerant.

Bench top direct contact thermal cycling systems. At present, most of these devices in the market use Tec refrigeration. Most of these products have cooling capacity attenuation and can not afford high-power devices. Therefore, chinacryo launched ts-660t contact high and low temperature impact machine, which completely adopts mechanical refrigeration, has no cooling capacity attenuation, and can consume power at - 40 ℃ @ 100W. It has a wide temperature range of - 65 to 200 ℃, and the cooling speed from - 40 ℃ to 25 ℃ takes only 2 minutes, It can meet the needs of the chip market, and can also realize a certain domestic substitution in performance.

In addition, chinacryo has also launched a high and low temperature cooling and heating platform for the testing of semiconductor devices or wafer level products. At present, such products are dominated by only two or three foreign manufacturers. In recent years, various domestic semiconductor manufacturers have also made breakthroughs in the field of sealing and testing equipment, and the demand for domestic supporting parts is increasing. On this basis, intercooling company has launched high and low temperature cooling and heating platforms, which are suitable for the equipment of sealing and testing equipment manufacturers, and gradually realize the replacement of domestic supporting parts, It is hoped that great breakthroughs will be made in the subdivision of supporting parts of semiconductor packaging and testing equipment to support the vigorous development of China's semiconductor industry.