1.Precon Test(Preconditioning Test) 

Purpose of Precon Test：To know the workability of Semiconductor devices after soldering.

It simulates delivery from assembly house to customers plant and soldering on PCB.

Defects after Precon Test：Package Crack，Delamination，Electrical Open/Short.

2.Reliability Test 

Purpose of Rel. Test:To know the workability of Semiconductor devices after Board Mounting in Real Situations which can be induced by actual users.

Procedure of Reliability Test：

1）T/C Test(Temperature Cycling Test)

Purpose of T/C:To know the durability of Semiconductor package resisting expansion and shrinkage by high and low temperature.

Test Conditions:Temp:+150/-65deg.C;Time:15min/zone;Read-out Point:1000 cycle ;Measurement ; Open/Short Test .

Failures after T/C Test :Open due to Bond Lift or Ball Neck Broken by the chip surface Delamination ,Short due to Cracked Die.

Open Failure after T/C Test:Die Top Delamination & Ball Neck Broken .

2)T/S Test(Thermal Shock Test)

Test Conditions ：Temp：+150/-65℃；Time : 15 min/ zone；Read-out Point : 1000 cycle；Measurement；Open/Short Test.

3）HTST(High Temperature Storage Test)

Purpose of HTST:To know the durability of Semiconductor package when exposed under the high temperature for long time.

Test Conditions：Temp：150℃；Read-out Point：1000HRS；Measurement；Open/Short Test.

4）T&H Test(Temperature & Humidity Test)

Purpose of T&H Test:To know the durability of Semiconductor PKG under the high temp and humidity condition .

Test Conditions：Temp：85℃； Humidity：85％；Read-out Point：1000HRS；Measurement；Open/Short Test.

5）PCT(Pressure Cooker Test)

Purpose of PCT：To know the existence of gap between EMC & L/F .

Test Conditions：Temp：121℃；Humidity：100％；Pressure：2ATM；Read-out Point : 168HRS；Measurement；Open/Short Test.

6）HAST(Highly Accelerated Stress Test)

Purpose of HAST：To know the existence of gap between EMC & Substrate.

Test Conditions：Temp：130℃；Humidity：100％，Pressure：33.3Psi；Read-out Point : 96HRS；Measurement；Open/Short Test.