The significance of TC (Temperature Cycling) high-temperature cycling test is to confirm the effect of mechanical stress on the welding performance of devices at extremely high temperatures, extremely low temperatures, and alternating high and low temperatures. In standard AEC-Q101-E, TC is a destructive experiment, and materials after TC execution cannot be used for other performance confirmation or use.

In the latest JESD22A-104F version, clear requirements have been put forward for the extreme high temperature, extreme low temperature selection, high and low temperature insulation time, and temperature rise and fall rate that the device will withstand during the testing process. The TC temperature curve is shown in the figure.

Choose different test conditions based on the maximum high and low temperatures that the equipment can withstand. If the equipment can meet the application environment of -55 ° C low temperature and+150 ° C high temperature, then select the high temperature and low temperature condition H in the TC test.

The longer the insulation time under high temperature and low temperature conditions, the greater the stress on the equipment. JESD22 A-104 standard recommends using insulation modes of 2,3,4 for packaging components that require verification during welding fatigue and creep testing, and generally selects method 1 for components.

Selection of temperature cycles per unit time: A typical temperature cycle requires completing 1-3 cycles within an hour. The more cycles, the more likely it is to fail. Its typical failure modes are fatigue and delamination. For typical temperature cycles of -55 ° to+150 °, it is recommended to complete 2 cycles within one hour. The high and low temperature insulation mode can be selected as 1 minute or 5 minutes.

The selection of high and low temperature change rate in the experiment: The selection of temperature rise and fall rate is based on the balance between appropriate solder joint fatigue testing and cycle testing efficiency. When conducting fatigue tests on interconnecting solder joints, a typical temperature change rate of 10-14 °/min is required.

The summary is as follows: TC (Temperature Cycling) high and low temperature cycle testing has five dimensions of requirements:

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