Magnetic resistive random access memory (MRAM) is a non volatile magnetic random access memory that relies on the (relative) magnetization state of two ferromagnetic layers to store binary information. It has the high-speed read and write capabilities of static random access memory (SRAM), as well as the high integration of dynamic random access memory (DRAM), and can be written indefinitely As a new type of NVM, MRAM has advantages such as near zero static power consumption, high read and write speed, and compatibility with complementary metal oxide semiconductor (CMOS) processes. It has been commercially applied in fields such as automotive electronics and wearable devices.

The device packaged with 12 inch memory MRAM technology needs to undergo rapid high and low temperature impact testing at -40 ° C to 125 ° C. The typical temperature conversion rate of the ThermoTST TS760 high and low temperature cycle testing system developed by Zhongleng Cryogenic Technology is -55 º C to+125 º C for about 10 seconds, meeting the R&D testing requirements of MRAM. It can also be applied to reliability tests such as product characteristic analysis, high and low temperature temperature variation testing, temperature impact testing, failure analysis, etc., such as chips, microelectronic devices, integrated circuits (SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.) Flash, UFS EMMC, PCBs, MCMs, MEMS, IGBT, sensors, small module components, optical communication (such as transceiver high and low temperature test, SFP optical module high and low temperature test, etc.), other electronic industries, new aerospace materials, laboratory research.

ThermoTST TS760 Precision Temperature Cycling System Main technical parameters:

Temperature range: -70 º C to+225 º C

Typical temperature conversion rate: -55 º C to+125 º C for approximately 10 seconds

Output gas flow rate: 4 to 18 scfm

Temperature accuracy: ± 1 ℃

Display accuracy: ± 0.1 ℃

Outlet flow rate: 4~18 SCFM (1.9L/s~8.5L/s)

Temperature control: internal: TC, remote/external: T, K

Compared with traditional high and low temperature test chambers, the main advantages of the ThermoTST TS760 Precision Temperature Cycling System are:

1. The rate of temperature rise and fall is very fast, ranging from -55 ℃ to 125 ℃ for about 10 seconds.

2. Temperature control accuracy: ± 1 ℃.

3. Online testing of IC can be carried out to monitor the performance changes caused by temperature shocks in real-time.

4. If there are many components on a PCB board, but you only need to perform high and low temperature impact on one of the ICs separately without affecting other surrounding components

5. Conduct temperature cycling or impact on the IC on the load board of the testing machine platform; Traditional temperature boxes cannot be used for such testing. 6. It can provide temperature environment or high/low temperature impact for the entire PCB board.