The quality of chips mainly depends on market, performance and reliability factors.

First, in the early stage of chip development, the market needs to be fully studied to define the SPEC that meets customer needs; The second is performance. The circuits designed by IC design engineers need to pass Designer simulation, DFT circuit verification, laboratory sample evaluation and FT, and believe that the performance meets the requirements defined in the early stage; Finally, reliability. Because the test chip can only ensure that the customer gets the sample for the first time, a series of stress tests need to be carried out to simulate the impact of some strict use conditions on the chip, so as to evaluate the life of the chip and possible quality risks.

The life of most semiconductor devices can exceed many years under normal use. But we can't wait for several years to study the device; We must increase the applied stress. The applied stress can enhance or accelerate the potential failure mechanism, help identify the root cause, and help TI take measures to prevent the failure mode.

Let's take a look at the common tests of chip reliability test:

Acceleration test: In semiconductor devices, some common acceleration factors are temperature, humidity, voltage and current. In most cases, the accelerated test does not change the physical characteristics of the fault, but will change the observation time. The change between acceleration conditions and normal use conditions is called "derating". High acceleration test is a key part of JEDEC-based qualification test.

Temperature cycle: according to JED22-A104 standard, the temperature cycle (TC) makes the parts undergo the conversion between extreme high temperature and low temperature. During this test, the components are repeatedly exposed to these conditions for a predetermined number of cycles.

High temperature working life HTOL: HTOL is used to determine the device reliability under high temperature working conditions. This test is usually conducted for a long time according to JESD22-A108 standard.

Temperature, humidity, bias and high accelerated stress test BHAST: According to JESD22-A110 standard, THB and BHAST make the device withstand high temperature and high humidity conditions, and at the same time under bias pressure, with the goal of accelerating the corrosion of the device. THB and BHAST have the same purpose, but BHAST conditions and test process make the reliability team test much faster than THB.

Thermal-pressor/unbiased HAST: Thermal-pressor and unbiased HAST are used to determine device reliability under high temperature and high humidity conditions. Like THB and BHAST, it is used to accelerate corrosion. However, unlike these tests, no bias is applied to the components.

High temperature storage: HTS (also known as "baking" or HTSL) is used to determine the long-term reliability of devices at high temperature. Unlike HTOL, the device is not under operating conditions during the test.

Electrostatic discharge ESD: static charge is the non-equilibrium charge at rest. Generally, it is caused by mutual friction or separation of insulator surfaces; One surface gains electrons and the other loses electrons. The result is an unbalanced electrical condition called static charge.

When static charge moves from one surface to another, it becomes electrostatic discharge (ESD) and moves between the two surfaces in the form of miniature lightning.

When the static charge moves, a current is formed, which can damage or destroy the gate oxide layer, metal layer and junction.

Zonglen chip reliability test equipment:

Cold and hot impact tester: applicable to reliability tests such as characteristic analysis, high and low temperature temperature change test, temperature impact test, failure analysis, etc. of chips, microelectronic devices, integrated circuits, optical communication (such as transceiver high and low temperature test, SFP optical module high and low temperature test, etc.), such as:

Product features:

·Fast temperature change rate, about 10 seconds from - 55 ℃ to+125 ℃

·Effective temperature range, - 80 ℃ to+225 ℃

·Compact and mobile design

·Touch screen operation, human-computer interface

·Fast DUT temperature stabilization time

·Temperature control accuracy ± 1 ℃, display accuracy ± 0.1 ℃

·Air flow can be up to 18SCFM

·Defrost design, quickly remove the internal moisture accumulation

·Meet the test requirements of American military standard MIL system, domestic military component GJB system and JEDEC

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