The ThermoTST series thermal system developed at medium-cooling and low temperature has a wider temperature range and wide application, which can meet the requirements of more production and engineering environments.

Application of ThermoTST series thermal system:

Characteristic analysis, high and low temperature temperature change test, temperature impact test, failure analysis and other reliability tests, such as:

Chip, microelectronic device, integrated circuit

(SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.)

Flash, UFS, eMMC

PCBs, MCMs, MEMS, IGBT, sensors, small module components

Optical communication (such as transceiver high and low temperature test, SFP optical module high and low temperature test, etc.)

Other electronic industries, aerospace new materials, laboratory research

ThermoTST series heat flow instrument features:

1. The temperature change rate is fast, and the conversion from - 55 ℃ to+125 ℃ is about 10 seconds

2. Effective temperature range, - 90 ℃ to+225 ℃

3. Compact structure and mobile design

4. Touch screen operation, human-computer interface

5. Fast DUT temperature stabilization time

6. Temperature control accuracy ± 1 ℃, display accuracy ± 0.1 ℃

7. Air flow up to 18SCFM

8. Defrost design, quickly remove the internal moisture accumulation

The structure design of ThermoTST series heat flow meter:

Pure mechanical refrigeration is used to provide high capacity, high flow rate and temperature controlled air flow for a closed and thermally isolated environment. A complete system consists of a main engine, a flexible hose, a support arm, a HEAD (heating head), and a heat shield (size optional). Insulated and insulated hoods prevent ambient air from entering, creating a closed, repeatable heat transfer environment. It can be applied to test circuit boards and electronic assembly devices of various shapes and sizes.