In the market competition, test development and mass production test are important links to enhance the product competitiveness of chip design companies, and play an important role in the semiconductor industry. Efficient test development can not only rapidly introduce high-quality and low-cost chip products to the market, but also effectively optimize mass production test operations to further reduce test costs, thereby improving the social efficiency of the entire semiconductor testing industry.

Semiconductor mass production test: the key and necessary link to realize the process from R&D to mass production.

Semiconductor mass production testing mainly includes wafer testing (CP) and finished product testing (FT). When a chip product is designed and taped, the fabricated wafer will go through the CP process. By running the CP test program on the ATE and Prober, the good chip and the bad chip will be separated. The good chips will be packaged into finished chips, and then run the FT test program on the ATE and the Handler. The sorted good products can be sent to customers after the next process.

In fact, to enter mass production, a chip not only needs to go through a set of very strict verification and testing processes, such as characteristic test and reliability test, but also needs to prepare a series of efficient and reliable test plans. This series of test plans must be able to reliably separate good products from bad products, and provide accurate measurement data to provide valuable information for reliability testing; At the same time, accurate and reliable data must be provided for designers in the characteristic verification test; Finally, we must separate the good products reliably in mass production with high efficiency and low cost.

ThermoTST TS580 high and low temperature impact airflow instrument developed by Intercooling Cryogenic Technology can be used not only for semiconductor characteristic analysis and reliability test, but also for high and low temperature temperature change test, temperature impact test, failure analysis, etc. Such as: chips, microelectronic devices, integrated electrical (SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.) flash flash, UFS, eMMC, PCBs, MCMs, MEMS, IGBT, sensors, small module components, optical communication (such as transceiver high and low temperature test, SFP optical module high and low temperature test, etc.), other electronic industries, aerospace new materials, laboratory research. The temperature conversion is from - 55 ℃ to+125 ℃ for about 10 seconds, with a wider temperature range of - 80 ℃ to+225 ℃.

The testing of semiconductor products will have an impact on profitability in terms of product launch time, testing cost and yield improvement. There are explicit costs and implicit costs.

The explicit cost of testing refers to the testing cost directly paid for testing chip products. It can be understood as test cost=test cost per second x time spent testing all DUTs. When the testing factory gives HR (hourly testing cost) or testing cost per second, it will quote a reasonable price according to the depreciation cost of testing machine and mass production supporting equipment, testing site cost, labor cost, and operating efficiency.

The hidden costs include quality, yield, impact of testing on packaging, and time cost.

Quality cost: ranking the impact of missed test on quality cost, CP<FT<SLT<board level test<terminal test<RMA of customer returned products

Cost of yield: improvement of yield by Trim test

Testing affects packaging costs: CP saves packaging costs

Cost of time: time to market