ATE, the full name of Automatic Test Equipment, refers to the chip automatic test bench, which is an automatic equipment for function and performance testing of chip wafers and chips after packaging. ATE testing is an indispensable part of the chip design manufacturing application industry chain.

ATE mainly tests the circuit functions and electrical performance parameters of semiconductor devices, including DC parameters (voltage and current), AC parameters (time, duty cycle, total harmonic distortion, frequency, etc.), function tests, etc. It is mainly used in chip design, wafer manufacturing and packaging test.

Corresponding to different types of ATE test benches, there are mainly four types of ATE boards: wafer test benches need to use probe cards and adapter boards (also called MLO in English), FT test benches need to use load boards, and aging test benches need to use burn in boards (BIB for short).

For the outsourcing orders of test boards, they mainly come from IC design enterprises. However, at present, due to the fact that domestic IC design companies have completed a large part of the design work of test boards themselves, there are not many outsourcing design parts, so there are relatively few outsourcing design enterprises of test boards.

Changchuan CTT3600 tester is a high-performance tester aiming at testing power devices. There are different specifications such as 1000V/50A, 2000V/100A, etc. It can mainly test power devices such as triode, MOSFET, diode, voltage regulator, IGBT, etc. The cold and hot shock testing machine TS580 developed by Chengdu Zhongliang Cryogenic Technology Co., Ltd. is used with the Changchuan CTT3600 testing machine for reliability tests such as power device characteristic analysis, high and low temperature temperature change test, temperature shock test and failure analysis.

Its characteristics are:

Fast temperature change rate, switching from - 55 ℃ to+125 ℃ for about 10 seconds

Effective temperature range, - 80 ℃ to+225 ℃

Compact and mobile design

Touch screen operation, man-machine interface

Fast DUT temperature stabilization time

Temperature control accuracy ± 1 ℃, display accuracy ± 0.1 ℃

Air flow up to 18SCFM

The defrosting design can quickly remove the moisture accumulation inside