The type of aging test used during the testing process will depend on different requirements. If you are unsure which testing method is most suitable, you can refer to the following three different types of available tests and their advantages and disadvantages to choose the appropriate method.
1. Static testing
During the static aging test, temperature and voltage are applied to each component without operating or exercising each component. This process is relatively simple. Simply install the probe into the environmental chamber and raise the chamber to the desired temperature. Subsequently, the required voltage is applied to the semiconductor component. Due to its low cost and simplicity, many manufacturers choose to use static aging.
However, this testing method cannot provide manufacturers with a comprehensive view of component reliability. This is because the static voltage applied during testing does not activate all nodes in the semiconductor. It can only be used as a thermal test to measure the condition of semiconductors when stored at extreme temperatures.
2. Dynamic testing
During the dynamic aging test, the aging system will apply multiple electrical stimuli to each component while exposing the semiconductor to high temperature and voltage. This testing method provides a more comprehensive view of component reliability. Monitoring the output during the evaluation process can better understand which points on the circuit board are most prone to faults. But this method also has a drawback. Dynamic aging cannot fully simulate the practical applications of semiconductors, so not all circuit nodes will undergo stress testing.
3. Dynamic aging test
The dynamic aging testing process allows technicians to monitor device outputs at various points during the aging process and confirm that each component is running. This method is suitable for manufacturers who want to quickly determine the aging "effects" that change over time, allowing the aging process to terminate at the optimal point. By detecting and eliminating these defective devices during the testing phase, product quality can be significantly improved.
Usually, a combination of static and dynamic aging tests is used to obtain the best results. After all, the performance data collected from these evaluations is crucial for improving manufacturing processes. Therefore, even if the cost is higher, more comprehensive testing is still beneficial.
Ultimately, the purpose of implementing an aging system is to ensure improved visibility and insight into the performance of manufactured semiconductors under pressure. Each testing phase should generate more statistically significant data to gain a clearer understanding of the failure probability of these devices. It has been proven that these data contribute to significantly increasing product yield and improving manufacturing processes to create higher quality semiconductors.