There are many differences between Temperature Forcing Systems and ThermoChamber. They are superior to ThermoChamber in terms of working principle and product characteristics, which are embodied in the following points:

Operating principle difference:

1. The output airflow hood of the testing machine will cover the tested object to form a test chamber in a relatively closed space. The high temperature or low temperature airflow output by the testing machine will cause drastic changes in the surface temperature of the tested object, thus completing the corresponding high and low temperature impact test;

2. It can isolate a single IC or other component from many components for high and low temperature impact without affecting other peripheral components. Compared with the traditional cold and hot impact test chamber, the impact rate of temperature change is faster.

Product features:

AIR and DUT temperature feedback mode at the same time, built-in TC AC compressor, special refrigeration design, environment-friendly refrigerant, pure mechanical refrigeration, no liquid nitrogen or any other consumable refrigerant, effective environmental protection; ESD anti-static protection design, touch screen operation, human-computer interaction interface, support test data storage, overheat temperature protection, heating mode, the refrigerator can be switched to standby mode to reduce power consumption, dry air flow continues to purge the test surface to prevent moisture condensation.

Main advantages and differences:

1. Faster temperature change rate

2. Temperature control accuracy: ± 1 ℃

3. Real-time monitoring of the real temperature of the element to be measured, and the impact air temperature can be adjusted at any time

4. For a single IC (module) among many components on the PCB, high and low temperature impact can be carried out separately without affecting other peripheral components

5. Conduct temperature cycling/impact on the IC on the tester platform; Traditional high and low temperature boxes cannot be used for such tests.

6. Provide accurate and fast ambient temperature for the whole integrated circuit board.