一、 Silicon carbide (SiCk) benefits from material properties:

① Higher blocking voltage and lower on resistance

② Unipolar operation in high voltage → reduce power loss and improve efficiency

③ High speed switch operation in high voltage → simplified system design

④ Higher resistance to cosmic ray failures

二、 Benefits and target applications of CoolSiCTM MOSFET silicon carbide:

The continuous development trend of semiconductor design is to increase the power density on the basis of reducing the switching loss, so as to use smaller radiators, increase the working frequency and reduce the size of magnetic components.

三、Energy saving and system integration promote the development of power electronics applications

1、The adoption of modern trench CoolSiCTM technology brings new opportunities

Planar DMOS: In the on state, it is necessary to make a trade-off between the performance and the reliability of the gate oxide layer;

Trench: It is easier to meet the performance requirements without violating the reliability of the grid oxide layer.

High Rdson at the reliability level equivalent to IGBT

2、CoolSiCTM MOSFE has the same oxide layer reliability as Si IGBT:

①Compared with the existing SiC MOSFET, it has excellent reliability;

②Reliability approaching Si IGBT

四、Extended reliability test and application related test

①The reliability test in the current standard is not enough to meet the requirements of future outdoor applications;

②Test the reliability test and application related test of the new SiC channel MOSFET using higher than these standards;

③Static and dynamic tests were carried out.

        The performance of ThermoTST TS-780 high and low temperature impact airflow meter developed by Intercooling Low Temperature Technology has reached a very high standard. It can be used for reliability tests such as characteristic analysis, high and low temperature temperature change test, temperature shock test, failure analysis, etc. For example, the airflow meter can also be used for IGBT tests, not only that, but also TS-780 can be used for testing: chips, microelectronic devices, integrated circuits (SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.); Flash, UFS, eMMC; PCBs, MCMs, MEMS, sensors, small module components; Optical communication (such as high and low temperature test of transceiver, high and low temperature test of SFP optical module, etc.); As well as other electronic industries, aerospace new materials, laboratory research. TS-780 temperature switches from - 55 ℃ to+125 ℃ for about 10 seconds, and has a wider temperature range from - 80 ℃ to+225 ℃; Through long-term multi working condition verification, it can meet the requirements of more production environment and engineering environment. TS-780 is pure mechanical refrigeration, without liquid nitrogen or any other consumable refrigerant, with fast temperature conversion rate, temperature control accuracy of ± 1 ℃, display accuracy of ± 0.1 ℃, and gas flow rate of up to 18SCFM. The reliability test with TS-780 not only reduces the potential errors and failure mechanisms of the device, but also effectively controls and guarantees the reliability of the device.